Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.
1～10 item / All 10 items
Bubble-free bonding device (OCR type)
In a panel assembly device for smartphones and tablet PCs, cover glass, switch boards, 3D boards, etc., are bonded to the LCD substrate in a vacuum.
Active in the assembly of difficult curved surfaces! Curved bonding equipment for large automotive panels such as instrument panels and flexible displays.
This product is a curved lamination device mainly for large panels used in vehicles. It laminates flexible displays such as LCDs and OLEDs to conform to the curved shape of an integrated S-shaped cover from the vehicle's instrument panel to the center console. [Lamination Examples] - Integrated curved cover glass for instrument panel and center console + OLED display (multi-bonding) - Curved resin cover + OLED lighting - S-shaped cover glass + LCD *For more details, please refer to the PDF document or feel free to contact us.
Ideal for research and development (elemental technology)! / Desktop vacuum laminator
- The glass substrate is held in a vacuum using a micro-adhesive pad and is attached to the lower substrate without bubbles. - The attachment operation is performed using an electrically operated precision Z stage. - The upper stage uses a quartz stage, allowing for observation of the bonding state and UV irradiation in a vacuum. - The upper and lower stages can be changed to a type with a built-in heater that reaches a maximum of 120°C.
Challenging cutting-edge design, we solve design constraints!
After contact in a vacuum, pressure is applied at high pressure (approximately 0.6 MPa, which is 0.5 MPa of gauge pressure plus atmospheric pressure), allowing for bonding that follows the curved surface without any air bubbles.
We provide bonding equipment that enables ultra-precision lap processing and polishing processing!!
To address the demands for microfabrication and the diversified ultra-high precision requirements sought in today's processing technology, and to enable further precision pursuit while utilizing the current lap and polish processing line, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process.
We accept mass production operations tailored to customer requests and specifications, such as high-quality products!
Currently, mass production of precision electronic devices is progressing overseas, but our company handles everything from development to mass production for products that are difficult to mass-produce overseas, such as "high-quality production requirements," "small lot production of various types," and "high-precision production requiring new technologies." We possess our own equipment, such as ACF devices and vacuum lamination devices, and we accept mass production tasks tailored to our customers' requests and specifications. Please feel free to contact us when you need assistance. 【Features】 ■ Comprehensive support from development to mass production for products that are difficult to mass-produce overseas ■ Ownership of our own equipment, such as ACF devices and vacuum lamination devices ■ Acceptance of mass production tasks according to customer requests and specifications *For more details, please refer to the PDF materials or feel free to contact us.
We will solve your problems with bonding and sealing! We can accommodate prototypes and demonstrations.
This product is a bonding device that proposes a new bonding process combining vacuum and atmosphere. In the bonding of flexible substrates, it resolves issues such as bubble entrapment in decorative panels with steps and slits. Additionally, flat bonding eliminates pressure unevenness and positional misalignment in thin substrates like films. 【Features】 ■ Line contact bonding (atmosphere/vacuum) Enables bonding under vacuum conditions, producing good quality products regardless of bonding conditions. ■ 3D/2.5D bonding (vacuum) Allows for bonding that conforms to curved surfaces by applying high pressure after contact in a vacuum. ■ Flat bonding (vacuum) Performs vacuum bonding with higher flatness accuracy and high-precision alignment than conventional methods. *For more details, please refer to the PDF document or feel free to contact us.
Flat and curved surface correspondence! The sticking operation is automatically controlled by PLC!
This product uses a adhesive mesh mechanism to hold the film substrate in a vacuum (patent pending) and attaches it to curved or flat cover glass or resin without bubbles. The attachment operation is automatically controlled by PLC. Optionally, a heater can be built into the lower stage (Max 150°C). 【Features】 ■ Holds the film substrate in a vacuum using an adhesive mesh mechanism (patent pending) ■ Can attach to curved or flat cover glass or resin without bubbles ■ Heater can be built into the lower stage (Max 150°C) - Optional *For more details, please refer to the PDF document or feel free to contact us.
We provide bonding equipment that enables ultra-precision lap processing and polishing processing!!
In order to address the demands for fine processing and the diversified ultra-high precision requirements sought in today's processing technology, and to enable further precision pursuit while utilizing the current lap and polish processing line, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process.
Realizing next-generation manufacturing processes with vacuum laminating devices.
The vacuum laminating device is a machine that allows you to place the target workpiece you want to laminate into a chamber and create a vacuum state inside the chamber to press the target under vacuum (diaphragm method). 【Capabilities】 Lamination Curved surface lamination Molding Sealing 【Use Cases】 Perovskite solar cells Space solar cells Micro LED displays 【Product Lineup】 Available in a wide range from a minimum size of 200mm square (desktop type) to a maximum size of 2M x 5M. The pressing pressure can be adjusted from atmospheric pressure (standard) to a maximum of 7 atmospheres (optional). Typically, shipping preparations are completed about 7 months after ordering, and on-site confirmation is possible. 【Demo Tests Ongoing】 A test vacuum laminating device that allows for prototyping and evaluation testing is available at our factory in Matsuyama City, Ehime Prefecture. We will propose the optimal recipe and pressing method tailored to the materials and specifications. Furthermore, we can also accommodate automation of the processes before and after the device (such as material supply and stacking processes). Please feel free to contact us for more details.
